Taiyo Holdings Unveils FPIM Series for Advanced Semiconductor Packaging

Taiyo Holdings Co., Ltd., headquartered in Tokyo, has introduced the 'FPIM Series,' a next-generation semiconductor-packaging material presented at the IEEE Electronics System-Integration Technology Conference (ESTC 2026) in Helsinki, Finland. The FPIM Series represents a significant advancement in semiconductor technology, achieving the first three-layer redistribution layer (RDL) formation with a 700-nm critical dimension (CD) on 12-inch wafers. The new material, a […]

NewsBeagle is a discovery engine. We show the headline, a short source-supplied summary and clear attribution. The complete reporting remains with the publisher.